Double microstrip transmission line having common defected ground structure and wireless circuit apparatus using the same
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United States of America Patent
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Jun 16, 2015
Grant Date -
May 10, 2012
app pub date -
Oct 6, 2011
filing date -
Nov 10, 2010
priority date (Note) -
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Abstract
Disclosed are a microstrip transmission line having a common defected ground structure (DGS) and a wireless circuit apparatus having the same. The microstrip transmission line realizes a common defected ground structure (DGS) and a double microstrip structure, and includes: a first dielectric layer; a first signal line pattern formed on a first surface of the first dielectric layer; a common ground conductive layer formed on a second surface of the first dielectric layer and having a defected ground structure, the first surface facing the second surface; a second dielectric layer having a first surface brought into contact with the common ground conductive layer, and facing the first dielectric layer while interposing the common ground conductive layer between the first dielectric layer and the second dielectric layer; and a second signal line pattern formed on a second surface of the second dielectric layer, the first surface facing the second surface.
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