Importance

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Abstract

The present invention relates to a surface mount package for a micro-electro-mechanical system (MEMS) microphone die and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components that simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the MEMS microphone die is mechanically attached, providing an interior surface for making electrical connections between the MEMS microphone die and the package, and providing an exterior surface for surface mounting the microphone package to a device's printed circuit board and for making electrical connections between the microphone package and the device's circuit board. The manufacturing process uses an unsingulated panel of individual substrates, each substrate having metal pads on its top and bottom surfaces, an unsingulated panel of individual sidewall spacers, and an unsingulated panel of individual lids. A MEMS microphone die is mounted on each substrate in the unsingulated panel of substrates, and the substrate panel, the sidewall panel, and the lid panel are joined together into a single panel, which is then singulated into individual MEMS microphones.

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First Claim