Method and apparatus for controlling and monitoring the potential
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United States of America Patent
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Jun 23, 2015
Grant Date -
Feb 23, 2012
app pub date -
Aug 19, 2010
filing date -
Aug 19, 2010
priority date (Note) -
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Abstract
An electroplating apparatus including a reference electrode to control the potential during an electro-deposition process. The electroplating apparatus may include a bath containing a plating electrolyte and an anode present in a first portion of the bath containing the plating electrolyte. A cathode is present in a second portion of the bath containing the plating electrolyte. A reference electrode is present at a perimeter of the cathode. The electroplating apparatus also includes a control system to bias the cathode and the anode to provide a potential. A measuring system is provided in electrical communication with the reference electrode to measure the potential of the cathode. Methods of using the above described electroplating apparatus are also provided. Structures and method for electroless deposition are also provided.
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