Methods and systems for dissipating heat in optical communications modules
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United States of America Patent
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Jun 23, 2015
Grant Date -
May 29, 2014
app pub date -
Nov 26, 2012
filing date -
Nov 26, 2012
priority date (Note) -
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Abstract
A heat dissipation solution is provided that is suitable for use in, but not limited to use in, CXP modules. The heat dissipation solution allows the performance of a CXP module to be significantly improved without having to increase the size of the heat dissipation device that is currently used with known CXP modules. The heat dissipation solution thermally decouples the heat dissipation path associated with the laser diodes from the heat dissipation path associated with other heat-generating components of the module, such as the laser diode driver IC and the receiver IC. Decoupling these heat dissipation paths allows the temperature of the laser diodes to be kept cooler as they are operated at higher speeds while allowing the temperatures of the other components to run hotter, if desired or necessary.
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