Printed circuit board assembly and a method for manufacturing the printed circuit board assembly
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United States of America Patent
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Jun 23, 2015
Grant Date -
May 1, 2014
app pub date -
Dec 7, 2011
filing date -
Dec 8, 2010
priority date (Note) -
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status (Latency Note)
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Abstract
Printed circuit board assembly including an optical subassembly having a carrying face for carrying at least one optoelectronic component in a such way that light emitted from/directed to is transmitted through the optical subassembly; a printed circuit board having a supporting area for supporting the optical subassembly; wherein the printed circuit board supporting area includes a hole lodging at least one part of the optoelectronic component and wherein at least one part of the carrying face is fixed by flip-chip bonding to at least one part of the supporting area.
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