Dual three-dimensional (3D) resistor and methods of forming
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United States of America Patent
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Jun 23, 2015
Grant Date -
Sep 18, 2014
app pub date -
Mar 14, 2013
filing date -
Mar 14, 2013
priority date (Note) -
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Abstract
Various embodiments include dual three-dimensional (3D) resistor structures and methods of forming such structures. In some embodiments, a dual 3D resistor structure includes: a dielectric layer having a first set of trenches extending in a first direction through the dielectric layer; and a second set of trenches overlayed on the first set of trenches, the second set of trenches extending in a second direction through the dielectric layer, the second set of trenches and the first set of trenches forming at least one dual 3D trench; and a resistor material overlying the dielectric layer and at least partially filling the at least one dual 3D trench along the first direction and the second direction.
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