Diode package having improved lead wire and manufacturing method thereof
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United States of America Patent
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Jun 23, 2015
Grant Date -
Apr 11, 2013
app pub date -
Mar 23, 2011
filing date -
Jun 21, 2010
priority date (Note) -
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Abstract
According to the present invention, there is provided a diode package in which a diode chip is sealed by a molding compound and a lead wire connected to the diode chip is led outside the molding compound, wherein the lead wire is divided into an upper lead wire and a lower lead wire, both lead wires each being formed in a long, flat plate and having a first stage and a second stage, both stages being opposite from each other, the upper side of the diode chip is attached to the lower side of the first stage of the upper lead wire, the lower side of the diode chip is attached to the upper side of the first stage of the lower lead wire, and the second stage of the upper lead wire and the second stage of the lower lead wire are led out in the lateral direction of the molding compound.
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