Cutting device and cutting method of a liquid crystal panel
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United States of America Patent
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Jun 30, 2015
Grant Date -
May 30, 2013
app pub date -
Nov 30, 2011
filing date -
Nov 30, 2011
priority date (Note) -
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status (Latency Note)
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Abstract
A cutting device and a cutting method of a liquid crystal panel are provided. The liquid crystal panel includes a first substrate and a second substrate assembled together. The cutting device of the liquid crystal panel includes a first cutting portion for cutting the first substrate and a second cutting portion for cutting the second substrate. The second cutting portion includes a support portion. The support portion is used to support the first substrate when the first cutting portion cuts the first substrate and the second cutting portion does not cut the second substrate yet. The present invention assures the cutting quality, improves the cutting efficiency and reduces the cutting cost.
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