Cooling system for electronics

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United States of America Patent

PATENT NO 9068784
APP PUB NO 20140133093A1
SERIAL NO

13677671

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method and apparatus for conveying heat away from an electronic component. The apparatus may include, a conformable thermal interface sleeve adapted to embrace the electronic component. The apparatus may further include, a heat conducting wedge adapted to contact the conformable thermal interface sleeve and a thermal channel adapted to contact the heat conducting wedge. The apparatus may also include a manifold adapted to contact the thermal channel.

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First Claim

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Patent Owner(s)

  • INTERNATIONAL BUSINESS MACHINES CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cox, Aaron R Tucson, US 72 669
Grady,, V William J Cary, US 1 9
Matteson, Jason A Raleigh, US 55 853
Minyard, Jason E Phoenix, US 32 197

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