Semiconductor device with a depletion channel and method of manufacturing the same

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United States of America Patent

PATENT NO 9070769
APP PUB NO 20120018805A1
SERIAL NO

13184654

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Abstract

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According to embodiments, a semiconductor device includes a semiconductor substrate and an element isolation insulating film which isolates a element formation region in a surface portion of the semiconductor substrate. A depletion-type channel region of a first conductivity type is formed in an inner region which is in the element formation region of the semiconductor substrate and is a predetermined distance or more away from the element isolation insulating film. A gate electrode is formed above the element formation region with a gate insulating film located in between in such a manner as to traverse over the channel region and to overlap with portions of the element isolation insulating film which are located on both sides of the element formation region. Source/drain regions of the first conductivity type are formed in the channel region respectively on both sides of the gate electrode.

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Patent Owner(s)

  • KABUSHIKI KAISHA TOSHIBA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kato, Yoshiki Mie-ken, JP 86 702

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