Method for slicing wafers from a workpiece
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United States of America Patent
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Jul 7, 2015
Grant Date -
Sep 27, 2012
app pub date -
Mar 19, 2012
filing date -
Mar 23, 2011
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A method for slicing wafers from a workpiece includes providing wire guide rolls that each have a grooved coating with a specific thickness, providing a fixed bearing respectively associated with each wire guide roll and providing a sawing wire including wire sections disposed in a parallel fashion. The wire sections are tensioned between the wire guide rolls and are moved relative to the workpiece so as to perform a sawing operation. The wire guide rolls cooled and the fixed bearings are cooled independently of the wire guide rolls.
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