Film for flip chip type semiconductor back surface, dicing tape-integrated film for semiconductor back surface, process for producing semiconductor device, and flip chip type semiconductor device

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United States of America Patent

PATENT NO 9074113
APP PUB NO 20120018902A1
SERIAL NO

13184994

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Abstract

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The present invention relates to a film for flip chip type semiconductor back surface to be formed on a back surface of a semiconductor element flip chip-connected to an adherend, the film for flip chip type semiconductor back surface containing an inorganic filler in an amount within a range of 70% by weight to 95% by weight based on the whole of the film for flip chip type semiconductor back surface.

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Patent Owner(s)

  • NITTO DENKO CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Asai, Fumiteru Osaka, JP 72 417
Shiga, Goji Osaka, JP 50 207
Takamoto, Naohide Osaka, JP 90 411

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