Reduced isotropic etchant material consumption and waste generation
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United States of America Patent
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Jul 7, 2015
Grant Date -
Mar 6, 2014
app pub date -
Nov 6, 2013
filing date -
Sep 2, 2009
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Abstract
Methods and apparatus for isotropically etching a metal from a work piece, while recovering and reconstituting the chemical etchant are described. Various embodiments include apparatus and methods for etching where the recovered and reconstituted etchant is reused in a continuous loop recirculation scheme. Steady state conditions can be achieved where these processes are repeated over and over with occasional bleed and feed to replenish reagents and/or adjust parameters such as pH, ionic strength, salinity and the like.
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