High precision metal thin film liftoff technique

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United States of America Patent

PATENT NO 9076658
SERIAL NO

14496674

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Abstract

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A metal film liftoff process includes applying a polymer layer onto a silicon substrate, applying a germanium layer over the polymer layer to create a bilayer lift off mask, applying a patterned photoresist layer over the germanium layer, removing an exposed portion of the germanium layer, removing the photoresist layer and a portion of the polymer layer to expose a portion of the substrate and create an overhanging structure of the germanium layer, depositing a metal film over the exposed portion of the substrate and the germanium layer, and removing the polymer and germanium layers along with the overlaying metal film.

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Patent Owner(s)

  • THE UNITED STATES OF AMERICA AS REPRESENTED BY THE ADMINISTRATOR OF THE NATIONAL AERONAUTICS AND SPACE ADMINISTRATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Brown, Ari D Ellicott City, US 9 24
Patel, Amil A Palo Alto, US 2 19

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