Method and structures for via substrate repair and assembly
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United States of America Patent
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Jul 7, 2015
Issued Date -
N/A
app pub date -
Dec 11, 2012
filing date -
Dec 11, 2012
priority date (Note) -
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Abstract
A component can include a substrate having an opening extending between first and second surfaces thereof, and an electrically conductive via having first and second portions. The first portion can include a first layer structure extending within the opening and at least partially along an inner wall of the opening, and a first principal conductor extending within the opening and at least partially overlying the first layer structure. The first portion can be exposed at the first surface and can have a lower surface located between the first and second surfaces. The second portion can include a second layer structure extending within the opening and at least partially along the lower surface of the first portion, and a second principal conductor extending within the opening and at least partially overlying the second layer structure. The second portion can be exposed at the second surface.
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