Low inductance flex bond with low thermal resistance
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United States of America Patent
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Jul 7, 2015
Grant Date -
May 1, 2014
app pub date -
Oct 29, 2012
filing date -
Oct 29, 2012
priority date (Note) -
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Abstract
A electronic circuit with low inductance connections is disclosed. The electronic circuit includes a ground plane and a flex circuit. The flex circuit having a first surface generally facing the ground plane and a second surface opposite to the first surface. The flex circuit also having a flexible bridge defined thereof. The electronic circuit further includes a first electronic device communicatively coupled to the second surface of the flex circuit, a second electronic device communicatively coupled to the second surface of the flex circuit, and at least one conductive trace defined on the second surface of the flex circuit and extending along the flexible bridge. One end of the at least one conductive trace is configured for receiving an outbound current from the first electronic device and another end of the at least one conductive trace is communicatively coupled to the second electronic device through a vertical interconnect access.
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