Packaging methods and structures for semiconductor devices

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9082636
APP PUB NO 20150044819A1
SERIAL NO

14523248

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Abstract

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Packaging methods and structures for semiconductor devices are disclosed. In one embodiment, a packaged semiconductor device includes a redistribution layer (RDL) having a first surface and a second surface opposite the first surface. At least one integrated circuit is coupled to the first surface of the RDL, and a plurality of metal bumps is coupled to the second surface of the RDL. A molding compound is disposed over the at least one integrated circuit and the first surface of the RDL.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Meng-Tse Changzhi Township, TW 100 1568
Cheng, Ming-Da Jhubei, TW 447 4774
Huang, Kuei-Wei Hsin-Chu, TW 72 1278
Jang, Bor-Ping Chu-Bei, TW 44 948
Lii, Mirng-Ji Sinpu Township, TW 254 6304
Lin, Chih-Wei Zhubei, TW 359 5145
Lin, Chun-Cheng New Taipei, TW 100 1465
Lin, Hsiu-Jen Zhubei, TW 172 1408
Lin, Wei-Hung Xinfeng Township, TW 175 1616
Liu, Chung-Shi Hsin-Chu, TW 824 11367
Lu, Wen-Hsiung Jhonghe, TW 127 2473
Tsai, Yu-Peng Taipei, TW 43 1203
Yu, Chen-Hua Hsin-Chu, TW 2207 47923

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