Engineered substrate assemblies with epitaxial templates and related systems, methods, and devices
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United States of America Patent
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Jul 14, 2015
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app pub date -
Jan 2, 2013
filing date -
Jan 2, 2013
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Abstract
Engineered substrates having epitaxial templates for forming epitaxial semiconductor materials and associated systems and methods are disclosed herein. In several embodiments, for example, an engineered substrate can be manufactured by forming a first semiconductor material at a front surface of a donor substrate. The first semiconductor material is transferred to first handle substrate to define a first formation structure. A second formation structure is formed to further include a second semiconductor material homoepitaxial to the first formation structure. The method can further include transferring the first portion of the second formation structure to a second handle substrate such that a second portion of the second formation structure remains at the first handle substrate.
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