Integrated circuit packaging system with posts and method of manufacture thereof
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United States of America Patent
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Jul 14, 2015
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N/A
app pub date -
Aug 13, 2013
filing date -
Jun 1, 2010
priority date (Note) -
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Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a semiconductor wafer having a chip pad; attaching a wafer frame to the semiconductor wafer, the wafer frame having a horizontal cover integral to a protruding connector with the protruding connector on the chip pad; forming an underfill around the protruding connector and between the horizontal cover and the semiconductor wafer; removing the horizontal cover exposing the underfill and the protruding connector; and singulating an integrated circuit package from the semiconductor wafer.
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