Integrated circuit package system with mounting features for clearance

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9084377
APP PUB NO 20080235941A1
SERIAL NO

11694913

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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An integrated circuit package system is provided including providing a substrate having a contact pad, forming a first conductor having a first melting point over the contact pad, forming a second conductor having a second melting point over the first conductor with the first melting point higher than the second melting point, and mounting a first device over the second conductor.

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First Claim

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Patent Owner(s)

  • STATS CHIPPAC PTE. LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chow, Seng Guan Singapore, SG 216 7150

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11.5 Year Payment $7400.00 $3700.00 $1850.00 Jan 14, 2027
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