Inspection of ball grid array soldering with boundary detection using tomographic artifact
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jul 14, 2015
Grant Date -
Nov 22, 2012
app pub date -
Mar 30, 2010
filing date -
Jan 19, 2010
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A substrate surface detection unit performs image analysis of cross-sectional images of an object to be inspected including a substrate and an electronic component and specifies a surface image on which the surface of the substrate is photographed. A pseudo cross-sectional image creation unit specifies a region of the solder for joining the substrate and the electronic component, the solder being photographed on the cross-sectional images, and creates a pseudo cross-sectional image in which an imaged region is made to have a thickness in a pseudo manner by piling up the cross-sectional images on which the solder is photographed. An inspection unit estimates whether the joint state of the solder is good or bad by performing image analysis on the region of the solder photographed on the surface image and the pseudo cross-sectional image.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully