Thin profile conductor assembly for medical device leads
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United States of America Patent
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Jul 21, 2015
Grant Date -
Sep 16, 2010
app pub date -
Feb 12, 2010
filing date -
Mar 12, 2009
priority date (Note) -
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status (Latency Note)
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Abstract
A medical device lead includes a thin profile conductor assembly. A proximal connector includes a proximal end that is configured to couple the lead to a pulse generator. An insulative lead body extends distally from the proximal connector. The conductor assembly extends distally from the proximal end within the lead body and includes a non-conductive tubular core member that defines a lumen, an outer insulative layer, and a multilayer conductor between the tubular core member and the outer insulative layer. The multilayer conductor is electrically connected to the proximal connector and includes a first conductive layer adjacent to the tubular core member and a second conductive layer adjacent to the first conductive layer opposite the tubular core member. A conductivity of the second conductive layer is greater than a conductivity of the first conductive layer.
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