Importance

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Abstract

A mold is fabricated with a cavity formed in an insulating layer formed so as to be placed on an upper surface of a conductive base material. This mold is disposed in an electrolyte bath to be applied with a voltage, and a metal is electrodeposited on the bottom surface of the cavity to electroform a metal-formed product in the cavity. In this electrodepositing process, when the width of the cavity is taken as W and a vertical height of a head space between an upper opening of the cavity and an upper surface of a metal layer is taken as H, the growth of the metal layer is stopped so that the height H of the head space left above the metal layer satisfies: where 300 μm≦W; H≧W/3.75 where 200 μm≦W<300 μm; H≧W/4 where 100 μm≦W<200 μm; and H≧W/10 where W<100 μm.

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First Claim