Structures and methods for improving solder bump connections in semiconductor devices

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United States of America Patent

PATENT NO 9087754
APP PUB NO 20150041977A1
SERIAL NO

14522664

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Abstract

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Structures with improved solder bump connections and methods of fabricating such structures are provided herein. The structure includes a via formed in a dielectric layer to expose a contact pad and a capture pad formed in the via and over the dielectric layer. The capture pad has openings over the dielectric layer to form segmented features. The solder bump is deposited on the capture pad and the openings over the dielectric layer.

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Patent Owner(s)

  • GLOBALFOUNDRIES INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Daubenspeck, Timothy H Colchester, US 147 1759
Gambino, Jeffrey P Westford, US 531 7344
Muzzy, Christopher D Burlington, US 130 1011
Sauter, Wolfgang Eagle-Vail, US 189 1603
Sullivan, Timothy D Underhill, US 138 1681

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