Semiconductor module including first and second wiring portions separated from each other

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9087831
APP PUB NO 20130187272A1
SERIAL NO

13558523

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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According to one embodiment, a semiconductor module includes a semiconductor chip that is mounted on a printed substrate, a terminal electrode that is formed on the printed substrate so as to be electrically connected to the semiconductor chip, a metal coating layer that is formed on the terminal electrode, a plating lead wire that is electrically connected to the terminal electrode, and a gap that is formed in the plating lead wire.

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First Claim

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Patent Owner(s)

  • TOSHIBA MEMORY CORPORATION

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ozawa, Isao Kanagawa, JP 51 726

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