Device for cutting a substrate and method for controlling such a cutting device

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United States of America Patent

PATENT NO 9089994
APP PUB NO 20150151451A1
SERIAL NO

14617660

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Abstract

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A device for cutting a substrate along a cutting line is disclosed. The device includes a saw unit with a saw blade, which can be rotated around an axis of rotation, a guide carriage for moving the saw unit along a guide rail, and a control device for controlling the saw unit and the guide carriage. A marking device is provided for marking an end point of the cutting line.

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Patent Owner(s)

Patent OwnerAddress
HILTI AKTIENGESELLSCHAFT9494 SCHAAN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Flock, Marcus Schuebelbach, DE 7 35

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