Stripping gold components and the method of stripping gold
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United States of America Patent
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Jul 28, 2015
Grant Date -
Nov 22, 2012
app pub date -
Apr 27, 2012
filing date -
May 18, 2011
priority date (Note) -
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Abstract
The invention provides a stripping gold component which could remove gold from substrate, comprising: a stripping gold chemical compound; and a assistant conductive compound wherein said stripping gold chemical compound bonds with gold to form covalent bond to strip gold from said substrate, said assistant conductive chemical compound helps the electric conduction and decreases the voltage, said substrate would not be damaged after stripping gold from said substrate, and the stripping gold component is cyanide free.
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