Integrated circuit packaging system with fan-in package and method of manufacture thereof
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United States of America Patent
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Jul 28, 2015
Grant Date -
Mar 17, 2011
app pub date -
Sep 17, 2009
filing date -
Sep 17, 2009
priority date (Note) -
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Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a base substrate; connecting a base component directly to the base substrate; mounting a stack component over the base component; attaching a flattened exposed interconnect directly on the stack component; and applying an encapsulant over the stack component with a portion of the flattened exposed interconnect exposed.
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