Methods of manufacture of top port multi-part surface mount MEMS microphones
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United States of America Patent
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Aug 4, 2015
Issued Date -
N/A
app pub date -
Jan 21, 2014
filing date -
Nov 28, 2000
priority date (Note) -
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Abstract
Methods for manufacturing multiple top port, surface mount microphones, each containing a micro-electro-mechanical system (MEMS) microphone die, are disclosed. Each surface mount microphone features a substrate with metal pads for surface mounting the package to a device's printed circuit board and for making electrical connections between the microphone package and the device's circuit board. The surface mount microphones are manufactured from panels of substrates, sidewall spacers, and lids. Each MEMS microphone die is lid-mounted and acoustically coupled to the acoustic port disposed in the lid. The panels are joined together, and each individual substrate, sidewall spacer, and lid cooperate to form an acoustic chamber for its respective MEMS microphone die. The joined panels are then singulated to form individual MEMS microphones.
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