Multilayered ceramic capacitor, mounting structure of circuit board having multilayered ceramic capacitor thereon, and packing unit for multilayered ceramic capacitor
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United States of America Patent
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Aug 4, 2015
Grant Date -
May 22, 2014
app pub date -
Feb 11, 2013
filing date -
Nov 20, 2012
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Abstract
There is provided a multilayered ceramic capacitor, including: a ceramic body having a plurality of dielectric layers laminated therein; an active layer including a plurality of internal electrodes having the respective dielectric layers interposed therebetween; an upper cover layer; a lower cover layer; external electrodes; and a plurality of dummy electrodes, wherein, when A is defined as ½ of an overall thickness of the ceramic body, B is defined as the thickness of the lower cover layer, C is defined as ½ of an overall thickness of the active layer, and D is defined as the thickness of the upper cover layer, a ratio of deviation between a center portion of the active layer and a center portion of the ceramic body, (B+C)/A, satisfies 1.063≦(B+C)/A≦1.745.
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