Semiconductor system, device and structure with heat removal
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United States of America Patent
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Aug 4, 2015
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N/A
app pub date -
Apr 24, 2013
filing date -
Aug 10, 2012
priority date (Note) -
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Abstract
A mobile system, including: a 3D device, the 3D device including: a first layer of first transistors, overlaid by at least one interconnection layer, where the interconnection layer comprises copper or aluminum; a second layer including second transistors, the second layer overlaying the interconnection layer, the second layer including: a plurality of electrical connections connecting the second transistors with the interconnection layer; and at least one thermally conductive and electrically non-conductive contact, the at least one thermally conductive and electrically non-conductive contact thermally connects the second layer to the top or bottom surface of the 3D device.
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