Apparatus and method for three dimensional inspection of wafer saw marks
Number of patents in Portfolio can not be more than 2000
United States of America
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Aug 11, 2015
Issued Date -
N/A
app pub date -
Apr 12, 2011
filing date -
Apr 12, 2011
priority date (Note) -
Withdrawn
status (Latency Note)
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Abstract
An apparatus (1) and a method for the three dimensional inspection of saw marks (2) on at least one surface (3) of a wafer (4) are disclosed. At least one camera (6) is required to capture an image of the entire surface (3) of the wafer (4). At least one line projector (8) provides a light bundle (5), centered about a central beam axis (9). The line projector (8) is arranged such that the central beam axis (9) is at an acute angle (α) with regard to the plane (P) of the wafer (4). A line shifter (12) is positioned in the light bundle (5) between each line projector (8) and the surface (3) of the wafer (4). A frame grabber (14) and an image processor (16) are used to synchronize and coordinate the image capture and the position of the pattern (20) of lines (22) on the front side (3F) and/or the back side (3B) of the wafer (4).
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