Package-on-package assembly with wire bond vias
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United States of America Patent
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Aug 11, 2015
Issued Date -
N/A
app pub date -
Feb 24, 2012
filing date -
Oct 17, 2011
priority date (Note) -
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status (Latency Note)
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Abstract
A microelectronic package can include wire bonds having bases bonded to respective ones of conductive elements exposed at a surface of a substrate. The wire bonds may have exterior edge surfaces disposed at an angle between 25° and 90° relative to the bases, and ends remote, e.g., opposite, from the bases, and remote from the ends which are connected to the bases. A dielectric encapsulation layer extends from the substrate and covers portions of the wire bonds such that covered portions of the wire bonds are separated from one another by the encapsulation layer, wherein unencapsulated portions of the wire bonds are defined by portions of the wire bonds that are uncovered by the encapsulation layer, the unencapsulated portions including the ends of the wire bonds.
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