Integrated circuit packaging system with routable traces and method of manufacture thereof
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United States of America Patent
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Aug 11, 2015
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N/A
app pub date -
Sep 26, 2013
filing date -
Dec 27, 2012
priority date (Note) -
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Abstract
A system and method of manufacture of an integrated circuit packaging system includes: a leadframe with a conductive layer on a leadframe active side for protecting a lead pad and a routable trace, the leadframe having an overmold recess at a leadframe inactive side; an overmold layer in the overmold recess, the overmold layer exposed between the lead pad and the routable trace for forming the lead pad and routable trace; an encapsulation directly on the conductive layer, the lead pad, the routable trace, and the overmold layer; and an external interconnect at the leadframe inactive side.
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