Microelectronic structure including air gap

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9105693
SERIAL NO

13614563

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A microelectronic structure and a method for fabricating the microelectronic structure provide a plurality of voids interposed between a plurality of conductor layers. The plurality of voids is also located between a liner layer and an inter-level dielectric layer. The voids provide for enhanced electrical performance of the microelectronic structure.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

  • GLOBALFOUNDRIES INC.

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Edelstein, Daniel C White Plains, US 301 6031
Horak, David V Essex Junction, US 328 7720
Huang, Elbert E Carmel, US 80 1627
Nitta, Satyanarayana V Poughquag, US 98 3434
Nogami, Takeshi Schenectady, US 231 4177
Ponoth, Shom Clifton Park, US 240 3555
Spooner, Terry A Clifton Park, US 91 1106

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
11.5 Year Payment $7400.00 $3700.00 $1850.00 Feb 11, 2027
Fee Large entity fee small entity fee micro entity fee
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00