Multilevel interconnect structures and methods of fabricating same

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United States of America Patent

PATENT NO 9105698
APP PUB NO 20140300005A1
SERIAL NO

14304111

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Abstract

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A multilevel interconnect structure for a semiconductor device includes an intermetal dielectric layer with funnel-shaped connecting vias. The funnel-shaped connecting vias are provided in connection with systems exhibiting submicron spacings. The architecture of the multilevel interconnect structure provides a low resistance connecting via.

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Patent Owner(s)

  • STMICROELECTRONICS S.R.L.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bonifacio, Marco Verderio Inferiore, IT 3 2
Cristofalo, Silvio Milan, IT 3 2
Di, Franco Antonio Osnago, IT 8 31

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