Semiconductor devices having compact footprints
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United States of America Patent
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Aug 11, 2015
Grant Date -
Dec 11, 2014
app pub date -
Jun 10, 2013
filing date -
Jun 10, 2013
priority date (Note) -
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Abstract
Semiconductor devices and methods for making semiconductor devices are disclosed herein. A semiconductor device configured in accordance with a particular embodiment includes a substrate having a source/drain region, an interconnect, and first and second electrodes extending between first and second sides of the substrate. The first electrode includes a first contact pad and a via extending through the substrate that connects the first contact pad with the interconnect. The second electrode includes a second contact pad and a conductive feature in the substrate that connects the second contact pad with the interconnect.
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