Apparatus and method for manufacturing an electronic package

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9111189
APP PUB NO 20090111393A1
SERIAL NO

11933024

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Abstract

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An apparatus to package an electronic device. The apparatus includes a composite plastic package that is durable to environmental conditions. In particular, a mold process to produce a plastic composite material package and support an electronic component inserted therein. At least one injection nozzle supplies a specified level of plastic composite material into the mold to produce a substantially hermetically sealed package. A multi-patch antenna provides increased receiver sensitivity. An inductive battery power option provides a user flexibility to charge a tracking device and communicate near-field signals and energy with a tracking monitoring station.

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Patent Owner(s)

Patent OwnerAddress
LBT IP LLC455 ELM STREET SUITE 100 GRAHAM TX 76450

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Butler, David Rugeley, GB 83 2702
Morse, David M Laguna Hills, US 28 1791
Scalisi, Joseph F Yorba Linda, US 50 2786

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