Image pickup device, image pickup module, and camera
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United States of America Patent
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Aug 18, 2015
Grant Date -
Jun 6, 2013
app pub date -
Aug 5, 2011
filing date -
Aug 23, 2010
priority date (Note) -
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Abstract
An image pickup device includes a transparent member, an image pickup element chip including a photodiode, and a fixing member arranged around the image pickup element chip, a space being surrounded by the transparent member, the image pickup element chip, and the fixing member. The image pickup element chip includes a semiconductor substrate including a penetrating electrode penetrating through a first main face of the semiconductor substrate on a side of the transparent member and a second main face of the semiconductor substrate opposite the first main face. In an orthogonal projection with respect to the transparent member, the penetrating electrode is arranged in a fixing area corresponding to the fixing member, and a boundary with an area where the thickness of the semiconductor substrate is smaller than that of the semiconductor substrate in a first area corresponding to the space is arranged within the fixing area.
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