Method of manufacturing solid-state imaging device and solid-state imaging device
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United States of America Patent
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Aug 18, 2015
Grant Date -
Apr 24, 2014
app pub date -
Apr 22, 2013
filing date -
Oct 23, 2012
priority date (Note) -
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status (Latency Note)
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Abstract
According to one embodiment, a method of manufacturing a solid-state imaging device includes a trench forming process, a concave portion forming process, a coating process, and a burying process. In the trench forming process, a trench is formed at the position to isolate a plurality of photoelectric conversion elements. In the concave portion forming process, a concave portion is formed at the position to form a light shielding film of shielding at least part of subject light incident on an adjustment photoelectric conversion element used for an image quality adjustment of an imaged image. In the coating process, inner circumferential surfaces of the trench and the concave portion are coated with an insulating film. In the burying process, a light shielding member is buried inside the trench and the concave portion whose inner circumferential surface are coated with the insulating film.
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