System and method for electrical testing of through silicon vias (TSVs)

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United States of America Patent

PATENT NO 9111895
SERIAL NO

13579562

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Abstract

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An embodiment of a testing system for carrying out electrical testing of at least one first through via extending, at least in part, through a substrate of a first body of semiconductor material. The testing system has a first electrical test circuit integrated in the first body and electrically coupled to the first through via and to electrical-connection elements carried by the first body for electrical connection towards the outside; the first electrical test circuit enables detection of at least one electrical parameter of the first through via through the electrical-connection elements.

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Patent Owner(s)

  • STMICROELECTRONICS S.R.L.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Pagani, Alberto Nova Milanese, IT 145 1069

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