Package substrate dynamic pressure structure
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United States of America Patent
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Aug 18, 2015
Grant Date -
Apr 24, 2014
app pub date -
Dec 28, 2013
filing date -
Jun 29, 2007
priority date (Note) -
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Abstract
Devices and methods for their formation, including electronic assemblies having a shape memory material structure, are described. In one embodiment, a device includes a package substrate and an electronic component coupled to the package substrate. The device also includes a shape memory material structure coupled to the package substrate. In one aspect of certain embodiments, the shape memory material structure is formed from a material selected to have a martensite to austenite transition temperature in the range of 50-300 degrees Celsius. In another aspect of certain embodiments, the shape memory material structure is positioned to extend around a periphery of the electronic component. Other embodiments are described and claimed.
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