Same layer microelectronic circuit patterning using hybrid laser projection patterning (LPP) and semi-additive patterning(SAP)

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United States of America Patent

PATENT NO 9113547
APP PUB NO 20100101084A1
SERIAL NO

12257688

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Abstract

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In some embodiments, same layer microelectronic circuit patterning using hybrid laser projection patterning (LPP) and semi-additive patterning (SAP) is presented. In this regard, a method is introduced including patterning a first density region of a laminated substrate surface using LPP, patterning a second density region of the laminated substrate surface using SAP, and plating the first and second density regions of the laminated substrate surface, wherein features spanning the first and second density regions are directly coupled. Other embodiments are also disclosed and claimed.

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Patent Owner(s)

  • INTEL CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Guzek, John Chandler, US 15 455
Li, Yonggang Chandler, US 76 387

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