Method and apparatus for detecting buried defects

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United States of America Patent

PATENT NO 9116109
APP PUB NO 20140319340A1
SERIAL NO

14230987

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Abstract

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One embodiment relates to a method of detecting a buried defect in a target microscopic metal feature. An imaging apparatus is configured to impinge charged particles with a landing energy such that the charged particles, on average, reach a depth within the target microscopic metal feature. In addition, the imaging apparatus is configured to filter out secondary electrons and detect backscattered electrons. The imaging apparatus is then operated to collect the backscattered electrons emitted from the target microscopic metal feature due to impingement of the charged particles. A backscattered electron (BSE) image of the target microscopic metal feature is compared with the BSE image of a reference microscopic metal feature to detect and classify the buried defect. Other embodiments, aspects and features are also disclosed.

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Patent Owner(s)

  • KLA-TENCOR CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Jiang, Ximan Milbrae, US 11 106
Xiao, Hong Pleasanton, US 115 2777

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