Chucking device and chucking method
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United States of America Patent
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Aug 25, 2015
Grant Date -
Jul 10, 2014
app pub date -
Jan 6, 2014
filing date -
Jan 8, 2013
priority date (Note) -
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status (Latency Note)
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Abstract
A chucking device is provided, the chucking device having low dusting characteristics and high detergent properties, and being capable of vacuum-sucking even a substrate having a large warpage, and a chucking method using the chucking device is also provided. The chucking device vacuum-sucks and holds a wafer. The chucking device includes a perforated plate having a plurality of through-holes and being mounted with a wafer, the through-holes penetrating through both sides of the perforated plate; a porous plate that supports a surface other than a mounting surface of the perforated plate, on which the wafer is mounted, transmits a vacuum state to the wafer through the plurality of through-holes, and has a pore to limit a flow rate; and a vacuum pump that exhausts an air through the pore of the porous plate.
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