Encapsulating layer-covered optical semiconductor element, producing method thereof, and optical semiconductor device

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United States of America Patent

PATENT NO 9117984
APP PUB NO 20140183593A1
SERIAL NO

14141607

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Abstract

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A method for producing an encapsulating layer-covered optical semiconductor element includes a disposing step of disposing an encapsulating layer at one side in a thickness direction of a support and a covering step of, after the disposing step, covering an optical semiconductor element with the encapsulating layer so as to expose one surface thereof to obtain an encapsulating layer-covered optical semiconductor element.

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Patent Owner(s)

  • EPISTAR CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ito, Hisataka Osaka, JP 54 693
Katayama, Hiroyuki Osaka, JP 227 1743
Noro, Hiroshi Osaka, JP 34 259

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