Semiconductor device with a light emitting semiconductor die
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United States of America Patent
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Sep 1, 2015
Grant Date -
Jun 23, 2011
app pub date -
Feb 28, 2011
filing date -
Jun 27, 2003
priority date (Note) -
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Abstract
A semiconductor device includes a light emitting semiconductor die mounted on at least one of first and second electrically conductive bonding pads, which are located on a first major surface of a substrate of the device. The light emitting semiconductor die has an anode and a cathode, which are electrically connected to the first and second electrically conductive bonding pads. The semiconductor device further includes first and second electrically conductive connecting pads, which are located on a second major surface of the substrate. The first and second electrically conductive bonding pads are electrically connected to the first and second electrically conductive connecting pads via first and second electrically conductive edge interconnecting elements.
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