Heat-expandable microspheres and a method of making heat-expandable microspheres and application thereof

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United States of America Patent

PATENT NO 9126178
APP PUB NO 20120064347A1
SERIAL NO

13321581

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Abstract

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Heat-expandable microspheres having high heat resistance and high solvent resistance, a production process thereof include a shell of a thermoplastic resin and a thermally vaporizable blowing agent being encapsulated therein. The thermoplastic resin includes a copolymer produced by polymerizing a polymerizable component containing a carboxyl-group-containing monomer. The surface of the heat-expandable microspheres is treated with an organic compound containing a metal of the Groups from 3 to 12 in the Periodic Table.

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Patent Owner(s)

Patent OwnerAddress
MATSUMOTO YUSHI-SEIYAKU CO LTD1-3 SHIBUKAWA-CHO 2-CHOME YAO-SHI OSAKA 5810075 ?5810075

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kita, Yu Yao, JP 4 7
Miki, Katsushi Yao, JP 26 204

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