Method of manufacturing a semiconductor device including a plurality of photoelectric conversion portions

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United States of America Patent

PATENT NO 9129877
APP PUB NO 20120202307A1
SERIAL NO

13366155

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Abstract

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A first waveguide member is formed, as viewed from above, in an image pickup region and a peripheral region of a semiconductor substrate. A part of the first waveguide member, which part is disposed in the peripheral region, is removed. A flattening step is then performed to flatten a surface of the first waveguide member on the side opposite to the semiconductor substrate.

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Patent Owner(s)

  • CANON KABUSHIKI KAISHA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Itahashi, Masatsugu Yokohama, JP 49 586
Okabe, Takehito Atsugi, JP 35 234
Suzuki, Sho Yamato, JP 55 133

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