Wire and semiconductor device

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9131611
APP PUB NO 20130134592A1
SERIAL NO

13684297

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Abstract

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A wire of an embodiment includes: a substrate; a metal film provided on the substrate; a metal part provided on the metal film; and graphene wires formed on the metal part, wherein the graphene wire is electrically connected to the metal film, and the metal film and the metal part are formed using different metals or alloys from each other.

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Patent Owner(s)

  • KABUSHIKI KAISHA TOSHIBA

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kitamura, Masayuki Kanagawa, JP 98 1132
Sakai, Tadashi Kanagawa, JP 166 1888
Wada, Makoto Kanagawa, JP 120 1304
Yamazaki, Yuichi Tokyo, JP 75 842

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